Amtech Systems, Inc.

Enabling AI Semiconductor Device Packaging and Advanced Substrate Fabrication

Amtech Systems is a global supplier of manufacturing equipment and materials for electronic assembly and semiconductor substrate processing. Our reflow equipment is used for advanced semiconductor packaging and demanding electronic assembly applications. Our consumables, parts and services support Chemical Mechanical Planarization (CMP) of conventional and advanced substrates.

A Global Supplier of Leading Premier Brand Name Products

BTU - ANAMTECHCOMPANY
entrepix - AN AMTECH COMPANY
PR HOFFMAN - AN AMTECH COMPANY
INTERSURFACE DYNAMICS - AN AMTECH COMPANY

Our business segments are made up of our four wholly-owned subsidiaries, which manufacture and sell our products under the leading premier brand names:  BTU International, Entrepix Inc., PR Hoffman™, and Intersurface Dynamics.

Wafer

Wafer

Device

Device

Semiconductor Package

Semiconductor Package

Electronics Assembly

Electronics Assembly

Material & Substrate

Silicon and Silicon Carbide

  • Lapping
  • Polishing
  • Cleaning & etching
  • CMP

Semiconductor

Advanced Materials & Components

  • Belt furnaces

Chip Fabrication

  • Diffusion furnaces

Packaging & SMT

  • Reflow ovens

Enabling Technologies for AI and Advanced Substate Processing Applications

  • Differentiated TrueFlat solder reflow equipment for processing ultra-thin substrates
  • High volume solder reflow equipment used by leading OSATs and OEMs for advanced packaging of most AI semiconductor devices
  • Expert services and process consumables for Chemical Mechanical Planarization (CMP) applications.