At Amtech Systems, we focus specifically on two high-growth sectors of the semiconductor market: Silicon Carbide and Power Semiconductors. Through our four wholly-owned subsidiaries (BTU International, Bruce Technologies™, Entrepix Inc., PR Hoffman™, and Intersurface Dynamics) we manufacture, sell and service a wide range of essential semiconductor equipment, including chemical mechanical polishing (CMP), lapping, wafer cleaning, diffusion furnaces, and thermal processing systems.
Entrepix, Inc., technology leader in CMP and wafer cleaning is now part of the Amtech Group. To learn more see the presentation on the Investors page of this website and visit www.Entrepix.com.
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In 1997, we acquired PR Hoffman, a premier brand that manufactures and sells lapping and polishing consumables and machines. PR Hoffman’s key customers include several major SiC, Si, and sapphire wafer producers.
of various sizes and materials, which combine the strength of hardened steel as the processing backbone with a softer plastic material in the work holes known as an insert.
which are used to securely hold silicon carbide, silicon, sapphire, or other wafer materials in place during single-sided wax-free polishing processes.
which are designed to process materials such as silicon wafers, sapphire, and other wafer-like materials.
In 2021, we acquired Intersurface Dynamics. Since 1985, Intersurface Dynamics has manufactured application-specific chemicals used to achieve specific surface morphologies on a variety of materials. Intersurface Dynamics’ customers include some of the world’s largest manufacturers of semiconductor devices, silicon wafers, precision optics, ophthalmic lens, advanced displays and flat glass.
In 2004, we acquired Bruce Technologies. Through this subsidiary, we produce and sell 200mm and 300mm horizontal diffusion and deposition furnaces to top players in the power chip, sensor, and analog sectors.
Our horizontal furnaces currently address several steps in the semiconductor manufacturing process, including diffusion, LPCVD, annealing, and high-temperature oxidation, which is used in silicon and silicon carbide power chips.
We acquired BTU International in 2015. Through this subsidiary, we produce and sell reliable thermal processing systems used in various stages of printed circuit board assembly and advanced semiconductor packaging.
Our printed circuit board assembly products are used primarily in the advanced, high-density segments of the market that utilize surface mount technology. Our key customers include various chip packaging, SMT, and custom engineered high-temperature belt furnace producers.
