Amtech Systems, Inc.

Patented Product

O2 Free Diffusion Process

The ATMOSCAN® is a closed capsule furnace loading system whose might is in its performance and in the impact it creates on your bottom line. Greater throughput yield, higher die per wafer yield and lower cycle time makes ATMOSCAN® the standard of the industry.

Wafer loads of 200 8" wafers (300 6" wafers) are achieved while superior process results are maintained. ATMOSCAN® provides a level of uniformity three times tighter than competing schemes.

Its tube within a tube design protects devices from particulates, and shortens cycle time by permitting a 900 degree C push/pull without warpage and crystal damage.

The system can exclude oxygen from the wafer environment down
to 2ppm, which makes it possible to control Qss and Native Oxide.

Atmoscan Standard Guarantee:

Control oxygen down to 2 ppm.
Particle counts on wafer surfaces will be less than
competing cantilever systems.
Wafer warpage as a result of push and pull will be
controlled and acceptable up to a pull temperature
of 900 degrees Celsius for wafers up to 200mm.
Deflection of the ATMOSCAN system is less than 6mm
with maximum load at 1050 degrees Celsius.

www.amtechsystems.com